Thermal Paste

  • High quality
  • – Special Properties: High conductivity, Lowbleed, Stable at high temperatures
  • – Primary Use: Thermal coupling of electronicdevices to heat sinks
  • – Thermal Conductivity

KSh 350.00

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Features & Compatibility

Thermal Paste

Thermal paste is a type of material used to fill the gap between the CPU and the heat sink, and this material is also referred to as a thermal interface material. Its function is to transfer the heat radiated by the CPU to the heat sink, keep the CPU temperature at a level that can work stably, prevent the CPU from being damaged due to poor heat dissipation, and prolong the service life.

Composed of Carbon Micro-particles it acts on electronic components, electricians, household appliances, LCDs, LEDs, CPU coolers and other products to increase heat transfer function, filling gaps, insulation, waterproof, moisture, shockproof, etc

Heatsink Compounds Thermal Paste HY510 is also Easy to Apply

Additionally has High Durability wetting the contact surface sufficiently to form a very low heat resistance surface, which is much more efficient than other heat sink product.

Additional information